Turnkey & Labor service
LAM/TEL/DNS Series
ServiceWET PROCESS · SINGLE WAFER
WET Process Single Wafer Process Equipment
Process platforms cover Mainframe, EFEM, chemical delivery systems (CDS) and Local Pump Cart configurations.
DCI · SINCE 2007
DING CHENG INTERNATIONAL
Specializing in the wet process domain, we offer comprehensive solutions ranging from spare parts to turnkey options for single wafer process tools.
Product & Service
T34 DS, T21 DS, S312 and CDS.
T34 DS
Product Inquiry Guideline
By Process, By Wafer Thickness, By Process Temperature, By Wafer/Glass Geometric Shape.
Start Product Inquiry GuidelineByproduct Remove, Particle Remove, WET Etching, Unconventinal Clean (CO2 Snow Flake Sublimation, Dry Clean for Particle Remove).
Standard (280 ~ 800 um): Front Side / Back Side; Thick (>800 um): Front Side / Back Side; Thin (50~280 um): Front Side.
Ultra High Temperature (70~120 ℃), Normal & High Temperature (25~70℃).
Round Shape, Square Shape, Rectangle Shape.
Brand abstraction; not DCI equipment, control architecture or monitoring results
Intelligence Upgrade & Monitor System
CIP performance optimisation and AI modules.
- 01MTC
- High-precision chemical temperature control
- 02WTG
- Wafer temperature gradient management
- 03SIS
- Signal Integration System
- 04CPS
- Cyber-physical integration and digital twin
Service
Turnkey & Labor service, site safety support.
Client-site construction safety support
Class A and Class C occupational safety and health operations, specified chemical substance operations, and organic solvent operations.
Client-site construction safety supportENGINEERING CONSULTATION
Contact
For equipment needs, system upgrades and engineering services, contact our team.
Business inquiry01 / TAINAN
Tainan locationNo. 5-86, Guanghua St., Xinshi Dist., Tainan 74449, TaiwanTEL +886-6-5892601FAX +886-6-5897936
02 / HSINCHU
Hsinchu location14F, No. 203, Xuguang 1st Rd., Zhudong Twp., Hsinchu County, TaiwanTEL +886-6-5892601