T34 DS
A 300 mm process platform for front-side and back-side processes.
View T34 DSWET PROCESS EQUIPMENT
Single Wafer Wet Process Equipment
Mainframe, EFEM and chemical delivery systems are integrated around wafer size and process requirements to form a complete single-wafer wet-process configuration.
- MERCURIOUS
- 300 mm
- VENUS
- 150 / 200 mm
- EFEM
- 1-4 Loadport
From process requirements to equipment
Explore 300 mm Mercurious, 150/200 mm Venus, EFEM and chemical delivery systems according to process requirements.
T34 F
For 300 mm thin wafers with a tapeless configuration, Bernoulli handling, front-side process and twin-fluid soft spray.
View T34 FS312
A 300 mm high-throughput dry-clean process platform with front-side process and CO2 snow-flake spray.
View S312T21 DS
A 150/200 mm wet-process model on the Venus platform for front-side and back-side processes.
View T21 DSStandard 1
Standard 1 with 1-4 loadports, TDK/ASYST load ports and TCP/IP or EtherCat user interfaces.
View Standard 1CDS
Chemical delivery systems include Type S, Type C and LPC for different supply conditions.
View chemical delivery systemsNot sure which model fits?
Start with process application, wafer thickness, process temperature and wafer or glass geometry.
EQUIPMENT VIEW
MERCURIOUS PLATFORM · 300 MM
T34 DS
Process equipment · T34 DS. 300 mm · Mercurious · Front side & Back side process.
300 mmMercuriousFront side & Back side process
The inquiry form will include model “T34 DS”.
WAFER SIZE300 mm
PLATFORMMercurious
PROCESS SIDEFront side & Back side process
SPRAY PROFILEUnlimited points for spray profile set up
SPRAY RANGEUp to 110%
CHEMICAL SPRAY1 or 2 Chemical Spray
SPRAY MODULETwin Fluid Soft Spray ・ Ultrasonic
Optional Modules
MTC High-Precision Chemical Temperature Control
SIS
DEB De-bubbling piping design
SBS Suck-back system
Smart dosing / mixing system design
Applications
Byproduct RemoveParticle RemoveWET EtchingTi/Cu
Confirm conditions in the Product Inquiry Guideline →Related Models
EQUIPMENT VIEW
MERCURIOUS PLATFORM · 300 MM
T34 F
Process equipment · T34 F. 300 mm thin wafer, tapeless · Mercurious · Bernoulli Handling.
300 mm thin wafer, tapelessMercuriousBernoulli Handling
The inquiry form will include model “T34 F”.
WAFER SIZE300 mm thin wafer, tapeless
PLATFORMMercurious
HANDLINGBernoulli Handling
PROCESS SIDEFront side process
SPRAY PROFILEUnlimited points for spray profile set up
SPRAY RANGEUp to 110%
CHEMICAL SPRAY1 or 2 Chemical Spray
SPRAY MODULETwin Fluid Soft Spray
EQUIPMENT VIEW
MERCURIOUS PLATFORM · 300 MM
S312
Process equipment · S312. 300 mm · Mercurious · 300 mm high throughput DRY clean process.
300 mmMercurious300 mm high throughput DRY clean process
The inquiry form will include model “S312”.
WAFER SIZE300 mm
PLATFORMMercurious
PROCESS300 mm high throughput DRY clean process
PROCESS SIDEFront side process
SPRAY PROFILEUnlimited points for spray profile set up
SPRAY RANGEUp to 110%
SPRAY MODULECO2 Snow Flake Spray
EQUIPMENT VIEW
VENUS PLATFORM · 150/200 MM
T21 DS
Process equipment · T21 DS. 150 / 200 mm · Venus · Front side & Back side process.
150 / 200 mmVenusFront side & Back side process
The inquiry form will include model “T21 DS”.
WAFER SIZE150 / 200 mm
PLATFORMVenus
PROCESS SIDEFront side & Back side process
SPRAY PROFILEUnlimited points for spray profile set up
SPRAY RANGEUp to 110%
CHEMICAL SPRAY1 to 3 Chemical Spray
SPRAY MODULETwin Fluid Soft Spray ・ Ultrasonic
EQUIPMENT VIEW
EFEM · 1–4 LOADPORT
Standard 1
Process equipment · Standard 1. 1–4 loadport · EFEM · TDK / ASYST.
1–4 loadportEFEMTDK / ASYST
The inquiry form will include model “Standard 1”.
LOADPORT1–4 loadport
PLATFORMEFEM
LOAD PORTTDK / ASYST
USER INTERFACETCP/IP, EtherCat
WAFER SIZEPlease contact engineering
THROUGHPUTPlease contact engineering