AI 智慧模組 · AI MODULE
Cyber-Physical System (CPS) ・ Digital Twin
AI Module covers the Cyber-Physical System (CPS) ・ Digital Twin, vibration spectrum monitoring, and the VISTARION position, wafer-handling and thermal-imaging monitors.
Turn tool state into readable data.
The AI Module covers CPS, Digital Twin and vibration spectrum monitoring, presenting tool state through a consistent interface.
- 01Digital Twin
- Digital Twin
- 02Vibration spectrum monitoring
- Spindle / Chuck Spin
Industrial AI monitoring interface
- 01Arm position check
- Arm Position Check
- 02Wafer on Chuck status
- Wafer on Chuck status
- 03Thermal image monitor
- Thermal Image Monitor
Chamber field and wafer-surface temperature distribution · Plumbing leakage monitoring