
PRODUCTS & SOLUTIONS
Equipment, chemical delivery, smart upgrades and services.
Five layers form a single wet-process engineering capability. Enter from the product side, or from the process condition side to reach an inquiry route.
01 · MAINFRAME
WET Process Single Wafer Process Equipment
Mercurious (300 mm) and T21 DS process platforms, plus Standard 1 with 1–4 loadports.
T34 DST21 DSStandard 1


02 · CHEMICAL DELIVERY
Chemical Delivery Systems
Standard CDS ・ Type S; Type C; local chemical supply including mixing and temperature control ・ LPC.
View systems →03 · SMART UPGRADE & MONITORING
Intelligence Upgrade & Monitor System
CIP Performance Optimization, plus Cyber-Physical System (CPS) ・ Digital Twin.
View programme →04 · REFURBISHED
2nd Hand Equipment
SEZ 323 · SEZ DV34.
View inventory →05 · SERVICES
Services
Turnkey & Labor Service (LAM / TEL / DNS Series) and on-site construction safety support.
View services →A
By Process
製程副產物洗淨移除 · 微粒汙染洗淨移除 · 濕蝕刻
金屬 Ti/Cu · 非金屬 Si · 有機 Polymer residue
Open the guide →金屬 Ti/Cu · 非金屬 Si · 有機 Polymer residue
B
By Wafer Thickness
Standard (280 ~ 800 um)
晶面與晶背 · 晶面
Open the guide →晶面與晶背 · 晶面
C
By Process Temperature
Ultra High Temperature 70–120 ℃
25 ~ 70 ℃
Open the guide →25 ~ 70 ℃
D
By Substrate Geometry
Round 150 / 200 / 300 mm · Square 120×120 mm · Rectangle 84×109 mm
Open the guide →+
二氧化碳雪花昇華法
CO₂ SNOW FLAKE SUBLIMATION乾式微粒移除洗淨 — 不適合液態洗淨 · 保護產品線路免於液態流衝擊 · ESG 考量
Open the guide →